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KOSBON

Through the uniformity management of the solder-plating layer, flexibility and straightness of the ribbon for solar cell modules are promoted. KOSBON supports the high-speed module operation and CTM conversion efficiency at its best.

BASE MATERIAL AND DIMENSIONS

BASE MATERIAL AND DIMENSIONS

Material OF-Cu Cu ≥ 99.95%
Dimension Round Tab Wire Diameter : 0.20 - 0.50mm
Tolerance : ± 2% of nominal diameter
Bus Ribbon Thickness : 0.20 - 0.50mm
Width : 4.00 - 7.00mm
Tolerance : ± 5% of nominal dimension
Mechanical Properties Specification
(Yield strength)
Bus Ribbon : Max. 120 MPa

SOLDER COMPOSITION AND PROPERTIES

SOLDER COMPOSITION AND PROPERTIES

Composition Liquidus temp.(℃)
Unleaded Sn96.5Ag3.0Cu0.5 219
Sn62Bi38 180
Leaded Sn62Pb36Ag2 190
Sn60Pb40 190
Sn63Pb37 184

* Solder Thickness :10~40μm, Tolerance : +/- 5μm

PACKING

H type

Type D(mm) d(mm) w(mm) L(mm) h(mm) Net wt.(kg)
P-10s 152 102 102 122 16.5 5
P-10 200 91 110 134 25 10

Biconical type

Type D(mm) d(mm) w(mm) L(mm) h(mm) Net wt.(kg)
HKV160 160 90 85 160 22.5 8