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KOSBON

通过统一管理焊料镀金层以寻求并达到太阳能电池模块焊带的柔软性及增直性,为客户提供高效模块作业及CTM转换效率。

基础材料及尺寸

Base Material and Dimensions

Material ETP-Cu
OF-Cu
UNS C11000 Cu ≥ 99.90%
UNS C10200 Cu ≥ 99.95%
UNS C10100 Cu ≥ 99.99%
Dimension Ribbon Thickness : 0.05 - 0.60mm
Width : 0.40 - 7.00mm
Tolerance : ± 5% of nominal dimension
Wire Diameter : 0.20 - 0.50mm
Tolerance : ± 2% of nominal diameter
Mechanical Properties
(Yield strength)
Ribbon : Down to 50MPa
Wire : Down to 80MPa

焊料成分及特性

Solder Composition and Properties

Composition Liquidus temp.(℃)
Unleaded Sn96.5Ag3.0Cu0.5 219
Sn62Bi38 180
Leaded Sn62Pb36Ag2 190
Sn60Pb40 190
Sn63Pb37 184

* Solder Thickness :10~40μm, Tolerance : +/- 5μm

PACKING

H type

Type D(mm) d(mm) w(mm) L(mm) h(mm) Net wt.(kg)
P-4 160 90 90 114 21 6
P-10S 152 102 102 122 16 5
DIN200 200 125 160 200 22 15
BS-1 270 150 92 106 52 15

Biconical type

Type D(mm) d(mm) w(mm) L(mm) h(mm) Net wt.(kg)
HKV160 160 90 85 150 22 7
HKV200 200 100 92 200 22 15