KOSWIRE

KOSBON

Through the uniformity management of the solder-plating layer, flexibility and straightness of the ribbon for solar cell modules are promoted. KOSBON supports the high-speed module operation and CTM conversion efficiency at its best.

BASE MATERIAL AND DIMENSIONS

Material	OF-Cu	Cu ≥ 99.95%
Dimension	Round Tab Wire	Diameter : 0.20 - 0.50mm Tolerance : ± 2% of nominal diameter
Dimension	Bus Ribbon	Thickness : 0.20 - 0.50mm Width : 4.00 - 7.00mm Tolerance : ± 5% of nominal dimension
Mechanical Properties Specification (Yield strength)		Bus Ribbon : Max. 120 MPa

SOLDER COMPOSITION AND PROPERTIES

Composition		Liquidus temp.(℃)
Unleaded	Sn96.5Ag3.0Cu0.5	219
Unleaded	Sn62Bi38	180
Leaded	Sn62Pb36Ag2	190
	Sn60Pb40	190
	Sn63Pb37	184

* Solder Thickness :10~40μm, Tolerance : +/- 5μm

PACKING

H type

Type	D(mm)	d(mm)	w(mm)	L(mm)	h(mm)	Net wt.(kg)
P-10s	152	102	102	122	16.5	5
P-10	200	91	110	134	25	10

Biconical type

Type	D(mm)	d(mm)	w(mm)	L(mm)	h(mm)	Net wt.(kg)
HKV160	160	90	85	160	22.5	8