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KOSBON

通过统一管理焊料镀金层以寻求并达到太阳能电池模块焊带的柔软性及增直性,为客户提供高效模块作业及CTM转换效率。

基础材料及尺寸

Base Material and Dimensions

Material OF-Cu Cu ≥ 99.95%
Dimension Round Tab Wire Diameter : 0.20 - 0.50mm
Tolerance : ± 2% of nominal diameter
Bus Ribbon Thickness : 0.20 - 0.50mm
Width : 4.00 - 7.00mm
Tolerance : ± 5% of nominal dimension
Mechanical Properties Specification
(Yield strength)
Bus Ribbon : Max. 120 MPa

焊料成分及特性

Solder Composition and Properties

Composition Liquidus temp.(℃)
Unleaded Sn96.5Ag3.0Cu0.5 219
Sn62Bi38 180
Leaded Sn62Pb36Ag2 190
Sn60Pb40 190
Sn63Pb37 184

* Solder Thickness :10~40μm, Tolerance : +/- 5μm

PACKING

H type

Type D(mm) d(mm) w(mm) L(mm) h(mm) Net wt.(kg)
P-10s 152 102 102 122 16.5 5
P-10 200 91 110 134 25 10

Biconical type

Type D(mm) d(mm) w(mm) L(mm) h(mm) Net wt.(kg)
HKV160 160 90 85 160 22.5 8